Strain Gages

These weldable strain gages can be easily attached using a compact spot welder.

Encapsulated gage is hermetically sealed. They consist of a sensing part and a cable to transmit output signals from the sensing part.

Encapsulated gage is hermetically sealed. They consist of a sensing part and a cable to transmit output signals from the sensing part.

Encapsulated strain gages are hermetically sealed. They consist of a sensing part and a cable to transmit output signals from the sensing part.

Encapsulated gage is hermetically sealed. They consist of a sensing part and a cable to transmit output signals from the sensing part.

Encapsulated gage is hermetically sealed. They consist of a sensing part and a cable to transmit output signals from the sensing part.

Encapsulated gage is hermetically sealed. They consist of a sensing part and a cable to transmit output signals from the sensing part.

These strain gages are for measuring internal stress in materials such as mortar and concrete. They are used embedded in measuring objects.

These strain gages are for measuring self shrinkage and self stress in cement materials.

These sensors are embedded in resin to measure hardening shrinkage and internal strain of the resin.

These self-temperature-compensating semiconductor strain gages are designed to minimize the effect of temperature changes by controlling the temperature coefficient of resistance of their material to match the linear expansion coefficient of the material being measured (Excluding type E5).

These semiconductor strain gages have stable characteristics and can be used for standard stress measurement and as sensors (transducers).

These semiconductor strain gages have especially high resistances (up to 10000 Ω).

These semiconductor strain gages have excellent resistance variation linearity for strain.

These strain gages measure crack length and propagation speed when attached using adhesive to a location on a structure or test material where cracking has occurred or is expected to occur.